XCY-3602 semiconductor oven

  • 产品详情


image28.png

Device technical parameters

1. Conventional size table, can be customized according to customer requirements

Model

Inner diameter size (unit: mm)

D*W*H

Outer dimensions (unit: mm)
D*W*H

Power

Temperature range

Volume

XCY-1001

500×600×600

750×1000×1250

5KW

rt+10~250℃

180L

XCY-1002

500×600×1000

750×1000×1650

8KW

rt+10~250℃

300L

XCY-2002

600×860×1000

850×1260×1650

12KW

rt+10~250℃

516L

XCY-2004

1000×1000×1000

1250×1400×1650

18KW

rt+10~250℃

1000L

XCY-2005

1000×1200×1600

1250×1600×2250

25KW

rt+10~250℃

1920L

2. Shell temperature: the outer wall temperature of the furnace does not exceed room temperature+15℃;

3. Adopt Japan OMRON temperature controller for temperature control, temperature fluctuation ±1℃, furnace internal temperature difference ±3℃.

4. Power supply: three-phase five-wire system, 380V, 50HZ;

5. Can be customized according to user needs to customize the trolley frame

6. Widely used in: drying and dehydration, curing, aging testing, high-temperature melting, constant temperature and other industries such as automotive parts, plastics, hardware, electronic products, chemical industry, etc.