XCY-3601 Semiconductor Oven

  • 产品详情

Equipment Technical Parameters

1. Conventional size table, can be customized according to customer requirements

Model

Inner diameter size (unit:mm)

D*W*H

Outer diameter size (unit:mm)
D*W*H

Power

Temperature range

Volume

XCY-1001

500×600×600

750×1000×1250

5KW

rt+10~250℃

180L

XCY-1002

500×600×1000

750×1000×1650

8KW

rt+10~250℃

300L

XCY-2002

600×860×1000

850×1260×1650

12KW

rt+10~250℃

516L

XCY-2004

1000×1000×1000

1250×1400×1650

18KW

rt+10~250℃

1000L

XCY-2005

1000×1200×1600

1250×1600×2250

25KW

rt+10~250℃

1920L

2. Shell temperature: the outside wall temperature of the furnace does not exceed room temperature + 15 ℃;

3. Using Japanese Omron temperature controller, temperature fluctuation ±1 ℃, furnace temperature difference ±3℃.

4. Power supply: three-phase five-wire system, 380V, 50HZ;

5. Customizable trolley according to user requirements.

6. Widely used in drying, dehydration, curing, aging testing, high temperature melting, constant temperature and other industries such as automotive parts, plastics, hardware, electronics, and chemical industry.