XCY-SDR-6004 Hot Air Circulating Glue Potting and Curing Oven

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Technical parameters of the equipment

1. Dimensions (approximately): L12000*W1400*H1800mm, heating zone length 8000mm

2. Shell temperature: the temperature of the outer wall of the furnace does not exceed room temperature +15°C;

3. Adopt high-temperature resistant double-speed chain conveying, front and rear for elevator docking, one-time glue filling and curing, two layers of independent transportation, the upper layer is heating and solidification, and the next layer is empty tray reflux

4. The preheating and curing temperature is 80-100°C, and the internal large air volume is circulated by hot air.
5. Power supply: three-phase five-wire system, 380V, 50HZ;
6. Power: about 60KW